W
W tip 330 wafer – curvature technique 1034 – fabrication 1087 – saw dilemma 1097, 1098 wafer-level vacuum packaging 1122 wafer-to-wafer – vacuum packaging 1114 – variation 1072 waste disposal concern 1090 water 613 – capillary force 847 – meniscus 461 water vapor 691, 695 – content 824 Watson-Crick base pairing 484 wear 498, see damage, 618, 793, 809 – contribution to friction 650 – control 832 – damage 824 – damage mechanism 823 – debris 521 – depths 1000 – measurement 325 – mechanical 263 – mechanism 522 – of tip 728 – performance 866 – process 822 – region 523 – resistance 822, 823, 853, 856, 879, 997, 1008 – study 879 – test 822 wearless – friction 884 – static friction 726 Weibull – distribution 774 – distribution function 1125 – statistics 1036 weight function 390 weighting functions for ?-synthesis 976 well-aligned nanowires 111 wet (chemical) etching 254 wet etching in HF 247 wettability 846 wetting 569 – lubricants 892 white-noise driven system 889 wire boundary scattering 121 wire cantilever 339 wireless communication 1094 work – hardening 704, 709 – of adhesion 844, 847, 1011 – of indentation 701 write/read scheme 931 writing mechanism 932