I
IB (ion beam) – coating 822 IBD (ion beam deposition) 796, 798, 815 IC (integrated circuit) 226, 988 – industry 1112 – package technology 1101 – packaging 1112 ideal nanobiological devices 282 IFM (interfacial force microscope) 610 IgG – repetitive 484 image – effects 710 – processing software 364 – topography 331, 406 image projection 1100 – system 1084 imaging – bandwidth 339 – electronic wave functions 427 – signal noise 389, 391 – tools 111 immunoassay – magnetic bead-based 271 immunogenic synthetic nanomaterials 313 immunoisolation 286, 313 immunosensor 271 immunosuppression 313 immunosurveillance 313 impregnation method 54 imprinted polymers 200 in situ – environmental TEM chamber 112 – screening 137 – sharpening of the tips 328 in vivo properties 676 InAs 417 InAs(110) 423, 435 incipient wetness impregnation 76 incommensurate surface 725, 731 indentation 498, 526, 923, 932, 935, 936 – creep process 528 – depth 527, 678, 806, 809, 998 – fatigue damage 812 – hardness 325, 527 – induced compression 812 – modulus 679 – size 527, 924 – size effect (ISE) 704 – technique 765 independent molecular operators 19 indirect sensor-device coupling 304 indirect transition in bismuth 129 indium tin oxide (ITO) 193 induction type EHD 262 inductive heating 1119 inelastic tunneling 419 inertial sensor 229 infected cell 756 influence of humidity – on adhesion 850 information technology 1139, 1142 initial contact 703 injection type EHD 262 ink – electronic 195 ink jet printing 193 inorganic-organic solar cells 136 InP(110) 392 in-phase signal 944 in-plane – actuation 929 – mechanical strain 188 instability position 461 instability, jump-to-position 388, 610 instrumented suspension 967 insulator 397 insuline pump 269 integrated – circuit (IC) 226, 988 – MEMS 259, 1084, 1092 – MEMS accelerometer 1091 – micromachining process 1117 – silicon suspension 967 – suspension 967 – tip 341, 373 – vacuum sealing 1117 Intel 915 intellectual property protection 1137 interaction – energy 757 – force 434, 757 – potential 718 interatomic – attractive force 344 – bonding 393 – force 332 – force constants 387 – interaction 1035 – spring constant 332 interbulk interactions 728 intercalated MoS2 833 intercellular adhesion molecule-1 (ICAM-1) 489 intercellular concentration 748 intercept length 855 interchain hydrogen bonding 621 interchain interactions 484 interconnect 900 interconnect technology 1094 interconnected operators 18 interdiffusion 568 interdigitation 568 interface sensor components 302 interfacial – chemistry 607 – defects 813 – energy (tension) see surface energy (tension) – force microscope (IFM) 610 – friction see also boundary lubrication, 571–574, 579, 580, 585, 862 – liquid structuring 888 – potential 726 – stress 819 – structuring 888 – wear 606 interferometeric detection sensitivity 353 interlocking macrocycles 26 intermediate or mixed lubrication 569, 570, 582, 583 intermittent contact mode 373, 460 intermolecular communication 18 intermolecular force 289, 481, 484, 606 internal friction 935 internal stress 1025, 1041 intersymbol interference 947 intertube distance 43 intraband transitions 423 intramolecular – forces 484 – self-assembly 293 intrinsic – adhesive force 832 – damping 469 – mean stress 1045 – stress 804 iodine 419 iodobenzene 419 ion – correlation forces 554, 557 – displacement 398 – implantation 205, 528, 925, 996 – implanted silicon 997 – plating techniques 795 – source 798 ion beam – deposition (IBD) 796, 798 – etching 248 – sputtered carbon 798 ion correlation forces 545 ionic bond 545 ionic strength 619 Ising spin model 892 isolated nanotubes 381 isotropic etching 189 isotropic layer 1050 itinerant nanotube levels 425 ITO (indium-tin-oxide) 195 I–V characterization 116, 124